SR MGR R&D/PRODUCT DVL ENGINEERING
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
TE Connectivity's Signal Integrity Center of Excellence (SI COE) drives research and development to solve critical bandwidth and high-speed interconnect challenges. The SI COE delivers validated signal integrity solutions to product teams and customers through advanced simulation, rigorous analysis, and precision measurement.
Core capabilities include detailed electrical modeling and simulation across connectors, cables, PCBs, semiconductor packages, and full systems — with a strong emphasis on model validation and correlation. The SI COE also establishes design guidelines, simulation methodologies, model quality standards, and reusable engineering workflows, while providing expert technical guidance to internal design teams and customers where signal integrity performance is paramount.
Areas of expertise span electromagnetics, microwave/RF engineering, test and measurement, integrated circuits, packaging, and system-level simulation.
Roles & Responsibilities
Team Leadership & Development
What your background should look like
Job Overview
TE Connectivity's Signal Integrity Center of Excellence (SI COE) drives research and development to solve critical bandwidth and high-speed interconnect challenges. The SI COE delivers validated signal integrity solutions to product teams and customers through advanced simulation, rigorous analysis, and precision measurement.
Core capabilities include detailed electrical modeling and simulation across connectors, cables, PCBs, semiconductor packages, and full systems — with a strong emphasis on model validation and correlation. The SI COE also establishes design guidelines, simulation methodologies, model quality standards, and reusable engineering workflows, while providing expert technical guidance to internal design teams and customers where signal integrity performance is paramount.
Areas of expertise span electromagnetics, microwave/RF engineering, test and measurement, integrated circuits, packaging, and system-level simulation.
Roles & Responsibilities
Team Leadership & Development
- Build, develop, and grow a high-performing engineering group aligned with the broader team strategy and organizational objectives
- Provide active mentorship to team members, helping navigate internal challenges and removing external roadblocks to sustain engineering momentum
- Manage a geographically distributed and diverse group of design engineers, fostering a culture of independence, accountability, and technical excellence
- Analyze workforce utilization and optimize workflows to maximize team efficiency and output
- Develop and administer project schedules, milestones, and performance requirements to ensure timely delivery
- Assess and mitigate project risk and ensure compliance across all team initiatives
- Determine the best course of action to meet delivery schedules and resolve complex technical challenges
- Plan and execute special projects to expand organizational capability and functional effectiveness
- Provide decisive leadership in resolving high-impact issues affecting the SI COE and its customers
- Evaluate complex, multi-variable situations — including business trends, technical feasibility, and manufacturing capabilities — to inform sound decision-making
- Drive collaboration across organizational levels, gaining alignment with System Architecture, Advanced Development, Advanced Manufacturing, Strategy, and Product Management teams
- Champion innovative and non-traditional approaches to enhance engineering performance and accelerate speed to market
- Build and leverage a strong internal technical network across TE Connectivity
- Serve as a key point of contact in interactions with customers and suppliers
What your background should look like
- Bachelor's degree or higher in Electrical Engineering or a closely related field
- 10+ years of product development engineering experience
- 3+ years of engineering management experience leading cross-functional or distributed teams
- Hands-on experience in the connector and cable assembly industry, with preference for high-speed I/O connectors, high-speed board-to-board connectors, and internal/external cable assemblies
- Demonstrated participation in the full product development lifecycle — from defining customer requirements through qualification and production release
- Proficiency with high-speed/high-frequency modeling and simulation tools such as Ansys HFSS, CST Microwave Studio, or Keysight ADS
- Deep understanding of high-speed signal integrity phenomena and their implications at the system level
- Familiarity with design-for-manufacturability (DFM) principles, including mechanical, environmental, electrical, and cost considerations
- Strong interpersonal and communication skills with a clear understanding of cross-functional team roles and dynamics
- Demonstrated leadership capability with a strong sense of accountability and the ability to influence without direct authority
- Ability to thrive in a global work environment, with flexibility to collaborate across time zones, including early morning and evening hours as needed
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